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09-05-2013, 02:08 PM
Cadence SPB OrCAD 16.50.46 Hotfix

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Cadence SPB OrCAD 16.50.46 Hotfix | 668 MB

Cadence Design Systems, Inc. announce hotfix version 014 for 16.60 release. This update includes some critical bug fixes. Cadence Design Systems, Inc., a leader in global electronic design innovation, launched the Cadence OrCAD 16.6 design solution with new features, enhanced customization capabilities, and 20 percent simulation performance improvements that provide customers a shorter, more predictable path to product creation.

This latest release offers numerous improvements to tool usability and performance, but at the heart of 16.6 are three key benefits: enhanced miniaturization capabilities, timing-aware physical implementation and verification for faster timing closure, and the industry's first electrical CAD team collaboration environment for PCB design using Microsoft SharePoint technology.

DATE: 06-7-2013 HOTFIX VERSION: 046
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CCRID PRODUCT PRODUCTLEVEL2 TITLE
================================================== =================================
1079538 F2B PACKAGERXL Ability to block all ¿single noded nets¿ to the board while packaging.
1123150 CONCEPT_HDL CORE property on y axis in symbol view was moved by visibility change to .
1144990 PCB_LIBRARIAN CORE PDV expand & collapse vector pins resizes symbol outline to maximum height
1149987 PCB_LIBRARIAN PTF_EDITOR Save As pushing the part name suffix into vendor_part_number value
1152755 CONCEPT_HDL COPY_PROJECT Copy project hangs if library or design name has an underscore
1153857 CONCEPT_HDL CORE Changing different power symbol should maintain the schematic level properties.
1155569 APD MODULES P1_U1 and P1_U3 Die pins are missing after Place Module.
1155728 CONCEPT_HDL CORE Unable to uprev packaged 16.3 design in 16.5 due to memory
1156547 ALLEGRO_EDITOR DRC_CONSTR Etch Turn under SMD pin rule check through pin Etch makes confused.
1158042 ALLEGRO_EDITOR DFA DFA_DLG writes the dra file name in uppercase.
1158528 CONCEPT_HDL OTHER Dual Monitor issue: Retain Hard Packaging option is missing and attribute test distorted
1158718 CONCEPT_HDL CHECKPLUS Customer could not get $PN property values on logical rule of CheckPlus16.6.
1159516 ALLEGRO_EDITOR EDIT_ETCH Unable to slide cline segment with new slide.
1160004 SCM UI The RMB->Paste does not insert signal names.
1161538 CONCEPT_HDL CORE Espice model value edited in DE HDL & then netlisting done, but it doesnt changes the earlier assigned model in Allegro
1162383 CONCEPT_HDL CHECKPLUS Checkplus not using $CDS_SITE/custom_help and $CDS_SITE/custom_rules_include directories.
1162686 CONCEPT_HDL CORE Changing NET_SPACING_TYPE to display both shows up with $NET_SPACING_TYPE
1165469 CONCEPT_HDL CORE Import Design loses design library name
1165801 CONCEPT_HDL PDF Pin texts of spun symbol overlap in publish PDF.
1165836 SIG_INTEGRITY GEOMETRY_EXTRACT Some nets has no result at Bus Simulation and Comprehensive simulation.(update)
1166819 CONCEPT_HDL CORE Cadence DEHDL Text Size Issue
1167519 ALLEGRO_EDITOR DATABASE Uprev dbdoctor does not log warnings about renaming properties.

A hot fix is a software maintenance package containing a small number of code fixes, designed to fix a sall number of critical problems. A hot fix enables a customer to receive fixes for urgent problems, without having to wait for the next service pack.

Each successive Fix Pack is comprehensive and contains the material from the earlier Fix Packs for that Release, as well as all Interim Fixes made available since the previous Fix Pack or full Release. In other words, when multiple Fix Packs are available, you would not need to apply Fix Pack 1 before applying Fix Pack 2.

About Cadence Design Systems, Inc.

Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry.





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